Display device

ABSTRACT

A display device includes a folding area, a first unfolding area located on a side of the folding area, and a second unfolding area located on a second side of the folding area. The display device further includes a display module which includes a display panel, and a first circuit board which is attached to the display panel and disposed under the display module, wherein the first circuit board includes a base film, a first driving integrated circuit (“IC”) disposed in the first unfolding area, and a second driving IC disposed in the second unfolding area where the first driving IC and the second driving IC do not overlap each other in a thickness direction during folding.

This application is a continuation of U.S. patent application Ser. No.16/796,601, filed on Feb. 20, 2020, which claims priority to KoreanPatent Application No. 10-2019-0035993, filed on Mar. 28, 2019, and allthe benefits accruing therefrom under 35 U.S.C. § 119, the content ofwhich in its entirety is herein incorporated by reference.

BACKGROUND 1. Field

Exemplary embodiments of the invention relate to a display device, andmore particularly, to a foldable display device that may switch betweena folded state and an unfolded state.

2. Description of the Related Art

A display device displays an image and includes a display panel such asan organic light emitting display panel or a liquid crystal displaypanel. Display devices are applied not only to fixed electronic devicessuch as televisions and monitors but also to mobile electronic devicessuch as smartphones and tablet personal computers (“PCs”) in order toprovide images to users. Recently, there is a growing demand for mobileelectronic devices having a relatively small volume or thickness whilehaving a larger display screen, and foldable or bendable display devicesthat may be folded and unfolded so as to provide a larger screen onlyduring a use are being developed.

SUMMARY

Exemplary embodiments of the invention provide a display device in whichdriving integrated circuits (“ICs”) disposed on a flexible printedcircuit board are prevented from contacting each other during bending.

However, exemplary embodiments of the invention are not restricted tothe one set forth herein. The above and other exemplary embodiments ofthe invention will become more apparent to one of ordinary skill in theart to which the invention pertains by referencing the detaileddescription of the invention given below.

An exemplary embodiment of the invention provides a display deviceincluding a folding area, a first unfolding area located on a side ofthe folding area, and a second unfolding area located on a second sideof the folding area. The display device further includes a displaymodule which includes a display panel, and a first circuit board whichis attached to the display panel and disposed under the display module,where the first circuit board includes a base film, a first driving ICdisposed in the first unfolding area, and a second driving IC disposedin the second unfolding area, where the first driving IC and the seconddriving IC do not overlap each other in a thickness direction duringfolding.

In an exemplary embodiment, a first indented portion may be recessedfrom a first edge of the first circuit board attached to the displaypanel in the folding area.

In an exemplary embodiment, the display device may further include asecond circuit board which includes a first base substrate attached tothe first unfolding area of a second edge facing the first edge of thefirst circuit board and a second base substrate attached to the secondunfolding area of the second edge, where a second indented portion ofthe first circuit board is recessed from the second edge in the foldingarea.

In an exemplary embodiment, a first width of the first indented portionin a direction from the first unfolding area toward the folding area maybe smaller than a second width of the second indented portion in thedirection from the first unfolding area toward the folding area.

In an exemplary embodiment, a plurality of folding holes may be definedin the first circuit board between the first indented portion and thesecond indented portion in the folding area, where the plurality offolding holes passes through the first circuit board in the thicknessdirection.

In an exemplary embodiment, the second circuit board may further includea flexible film disposed in the folding area, where the flexible filmconnects the first base substrate and the second base substrate.

In an exemplary embodiment, the first base substrate may include a thirddriving IC and a first signal wiring which connects the third driving ICand the first circuit board, where the first signal wiring is disposedover the flexible film.

In an exemplary embodiment, the first base substrate may include a thirddriving IC and a first signal wiring which connects the third driving ICand the first circuit board, where the first signal wiring is disposedover the first circuit board along the second indented portion of thefirst circuit board.

In an exemplary embodiment, the display device may further include asignal wiring which directly connects the first driving IC and thesecond driving IC, where the signal wiring is a timing synchronizationwiring.

In an exemplary embodiment, the first circuit board may further includea first sub-circuit board on which the first driving IC is disposed anda second sub-circuit board on which the second driving IC is disposed,where the first sub-circuit board and the second sub-circuit board areseparated from each other with the folding area interposed between thefirst sub-circuit board and the second sub-circuit board.

In an exemplary embodiment, the first circuit board may further includea first edge attached to the display panel and a second edge facing thefirst edge and an indented portion is recessed from the second edge ofthe first circuit board.

In an exemplary embodiment, a plurality of folding holes may be definedin the first circuit board between the indented portion and the firstedge of the first circuit board in the folding area, where the foldingholes pass through the first circuit board in the thickness direction.

In an exemplary embodiment, the display module may further include afirst surface on which the first circuit board is disposed and a secondsurface which is located opposite the first surface, where the firstunfolding area of the first surface of the display module and the secondunfolding area of the first surface of the display module face eachother with respect to the folding area of the first surface.

In an exemplary embodiment, a first area of the first circuit boardwhich overlaps the first unfolding area may have a greater width than asecond area of the first circuit board which overlaps the secondunfolding area, and a distance from the folding area to the firstdriving IC is greater than a distance from the folding area to thesecond driving IC.

An exemplary embodiment of the invention provides a display device. Thedisplay device includes a folding area, a first unfolding area locatedon a side of the folding area, and a second unfolding area located on asecond side of the folding area. The display device further includes adisplay module which includes a display panel, and a first circuit boardwhich is disposed under the display module and includes a first edgeattached to the display panel where a first indented portion is recessedfrom the first edge of the first circuit board in the folding area.

In an exemplary embodiment, the display device may further include asecond circuit board which includes a first base substrate attached tothe first unfolding area of a second edge facing the first edge of thefirst circuit board and a second base substrate attached to the secondunfolding area of the second edge.

In an exemplary embodiment, a second indented portion may be recessedfrom the second edge of the first circuit board in the folding area.

In an exemplary embodiment, a plurality of folding holes may be definedin the first circuit board between the first indented portion and thesecond indented portion in the folding area, where the folding holespass through the first circuit board in a thickness direction.

In an exemplary embodiment, the display module may further include afirst surface on which the first circuit board is disposed and a secondsurface which is located opposite the first surface, where the firstunfolding area of the second surface of the display module and thesecond unfolding area of the second surface of the display module faceeach other with respect to the folding area of the second surface.

An exemplary embodiment of the invention provides a display deviceincluding a folding area, a first unfolding area located on a side ofthe folding area, and a second unfolding area located on a second sideof the folding area. The display device includes a display module whichincludes a display panel, and a first circuit board which is attached tothe display panel and disposed under the display module, where the firstcircuit board includes a base film, a first driving IC disposed in thefirst unfolding area, and a second driving IC disposed in the secondunfolding area, where the first driving IC and the second driving IC aredisposed inside the first circuit board, and a surface of the firstdriving IC and a surface of the second driving IC are lower than asurface of the base film.

BRIEF DESCRIPTION OF THE DRAWINGS

These and/or other exemplary embodiments will become apparent and morereadily appreciated from the following description of the exemplaryembodiments, taken in conjunction with the accompanying drawings inwhich:

FIG. 1 is a plan view of an exemplary embodiment of a display device;

FIG. 2 is a plan view of an exemplary embodiment of a first circuitboard;

FIG. 3 is a cross-sectional view taken along line of FIG. 2 ;

FIG. 4 is a perspective view of the exemplary embodiment of the displaydevice;

FIG. 5 is a cross-sectional view taken along line V-V′ of FIG. 4 ;

FIG. 6 is a plan view of an exemplary embodiment of a back surface ofthe display device;

FIG. 7 is a perspective view illustrating a folded state of theexemplary embodiment of the display device;

FIG. 8 is a perspective view of an exemplary embodiment of a displaydevice;

FIG. 9 is a perspective view illustrating a folded state of theexemplary embodiment of the display device of FIG. 8 ;

FIG. 10 is a plan view of an exemplary embodiment of a display device;

FIG. 11 is a plan view of an exemplary embodiment of a display device;

FIG. 12 is a plan view of an exemplary embodiment of a display device;

FIG. 13 is a plan view of an exemplary embodiment of a display device;

FIG. 14 is a plan view of an exemplary embodiment of a display device;

FIG. 15 is a plan view of an exemplary embodiment of a display device;

FIG. 16 is a plan view of an exemplary embodiment of a display device;

FIG. 17 is a plan view of an exemplary embodiment of a display device;

FIG. 18 is a perspective view of an exemplary embodiment of a displaydevice;

FIG. 19 is a cross-sectional view taken along line XIX-XIX′ of FIG. 18 ;and

FIG. 20 is a perspective view of an exemplary embodiment of a displaydevice.

DETAILED DESCRIPTION

It will be understood that when an element is referred to as being “on”another element, it can be directly on the other element or interveningelements may be present therebetween. In contrast, when an element isreferred to as being “directly on” another element, there are nointervening elements present.

It will be understood that, although the terms “first,” “second,”“third” etc. may be used herein to describe various elements,components, regions, layers and/or sections, these elements, components,regions, layers and/or sections should not be limited by these terms.These terms are only used to distinguish one element, component, region,layer or section from another element, component, region, layer orsection. Thus, “a first element,” “component,” “region,” “layer” or“section” discussed below could be termed a second element, component,region, layer or section without departing from the teachings herein.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting. As used herein, thesingular forms “a,” “an,” and “the” are intended to include the pluralforms, including “at least one,” unless the content clearly indicatesotherwise. “Or” means “and/or.” As used herein, the term “and/or”includes any and all combinations of one or more of the associatedlisted items. It will be further understood that the terms “comprises”and/or “comprising,” or “includes” and/or “including” when used in thisspecification, specify the presence of stated features, regions,integers, steps, operations, elements, and/or components, but do notpreclude the presence or addition of one or more other features,regions, integers, steps, operations, elements, components, and/orgroups thereof.

Furthermore, relative terms, such as “lower” or “bottom” and “upper” or“top,” may be used herein to describe one element's relationship toanother element as illustrated in the Figures. It will be understoodthat relative terms are intended to encompass different orientations ofthe device in addition to the orientation depicted in the Figures. Forexample, if the device in one of the figures is turned over, elementsdescribed as being on the “lower” side of other elements would then beoriented on “upper” sides of the other elements. The exemplary term“lower,” can therefore, encompasses both an orientation of “lower” and“upper,” depending on the particular orientation of the figure.Similarly, if the device in one of the figures is turned over, elementsdescribed as “below” or “beneath” other elements would then be oriented“above” the other elements. The exemplary terms “below” or “beneath”can, therefore, encompass both an orientation of above and below.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper” and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, if the device in thefigures is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the exemplary term “below” can encompass both anorientation of above and below. The device may be otherwise oriented(rotated 90 degrees or at other orientations) and the spatially relativedescriptors used herein interpreted accordingly.

“About” or “approximately” as used herein is inclusive of the statedvalue and means within an acceptable range of deviation for theparticular value as determined by one of ordinary skill in the art,considering the measurement in question and the error associated withmeasurement of the particular quantity (i.e., the limitations of themeasurement system). For example, “about” can mean within one or morestandard deviations, or within ±30%, 20%, 10%, 5% of the stated value.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure belongs. It willbe further understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art and thepresent disclosure, and will not be interpreted in an idealized oroverly formal sense unless expressly so defined herein.

Exemplary embodiments are described herein with reference to crosssection illustrations that are schematic illustrations of idealizedembodiments. As such, variations from the shapes of the illustrations asa result, for example, of manufacturing techniques and/or tolerances,are to be expected. Thus, embodiments described herein should not beconstrued as limited to the particular shapes of regions as illustratedherein but are to include deviations in shapes that result, for example,from manufacturing. For example, a region illustrated or described asflat may, typically, have rough and/or nonlinear features. Moreover,sharp angles that are illustrated may be rounded. Thus, the regionsillustrated in the figures are schematic in nature and their shapes arenot intended to illustrate the precise shape of a region and are notintended to limit the scope of the present claims.

FIG. 1 is a plan view of an exemplary embodiment of a display device 1.FIG. 2 is a plan view of an exemplary embodiment of a first circuitboard 300. FIG. 3 is a cross-sectional view taken along line of FIG. 2 .FIG. 4 is a perspective view of the exemplary embodiment of the displaydevice 1. FIG. 5 is a cross-sectional view taken along line V-V′ of FIG.4 . FIG. 6 is a plan view of a back surface of the exemplary embodimentof the display device 1. FIG. 1 illustrates a front surface of thedisplay device 1 of FIG. 1 .

Referring to FIGS. 1 through 6 , the display device 1 is a device fordisplaying moving images or still images. The display device 1 may beused as a display screen in portable electronic devices such as a mobilephone, a smartphone, a tablet personal computer (“PC”), a smart watch, awatch phone, a mobile communication terminal, an electronic notebook, anelectronic book, a portable multimedia, play (“PMP”), navigation systemand a ultra-mobile PC (“UMPC”), as well as in various products such as atelevision, a notebook computer, a monitor, a billboard and the Internetof things (“IoT”).

The display device 1 may be a foldable display device. As used herein,the term “foldable” may refer to a flexible state, specifically, mayinclude bendable, rollable, etc. Further, the term “foldable” should beinterpreted to include all of “partially” foldable indicating that afolding area to be described later is applied to only a part of thedisplay device 1 instead of completely crossing the display device 1 inorder to apply a foldable function to only a part of the display device1, “entirely” foldable indicating that the folding area completelycrosses the display device 1 in order to apply the foldable function tothe whole of the display device 1, “in” foldable indicating that adisplay surface is covered when the display device 1 is folded, and“out” foldable indicating that the display surface faces outward whenthe display device 1 is folded.

The display device 1 may include a display area DA and a non-displayarea NA disposed around the display area DA. The display area DA is anarea where a screen is displayed, and the non-display area NA is an areawhere no screen is displayed. The display area DA may be located in acentral part of the display device 1. A direction that the display areaDA faces when the display device 1 is unfolded will be defined as afront side, and a side opposite the front side will be defined as a backside.

In an exemplary embodiment, the display device 1 may have asubstantially rectangular shape with rounded corners in a plan view, forexample. The display device 1 may include four edges. That is, asillustrated in FIG. 1 , the display device 1 may include long edgesextending along a first direction DR1 and short edges extending along asecond direction DR2. However, the invention is not limited thereto, andother shapes such as a square and a circle may also be applied as theplanar shape of the display device 1.

The front surface of the display device 1 may include a folding area FA,a first unfolding area UFA1 located on a side (e.g., left side in FIG. 1) of the folding area FA, and a second unfolding area UFA2 located onthe other side (e.g., right side in FIG. 1 ) of the folding area FA. Thefolding area FA may be an area where the display device 1 is folded orbent with a predetermined curvature in a folding direction, and theunfolding areas UFA1 and UFA2 may be areas that are not folded, unlikethe folding area FA. However, the invention is not limited to this case,and each of the unfolding areas UFA1 and UFA2 may also be partiallyfolded in the folding direction.

In an exemplary embodiment, the folding area FA may be located betweenfolding lines FL1 and FL2 crossing the long edges as illustrated in FIG.1 , for example. The first unfolding area UFA1 may be located on a sideof the folding area FA in the first direction DR1, and the secondunfolding area UFA2 may be spaced apart from the first unfolding areaUFA1 with the folding area FA interposed between them and may be locatedon the other side of the folding area FA in the first direction DR1. Thedisplay area DA of the folding area FA, the first unfolding area UFA1and the second unfolding area UFA2 may be an area where a screen isdisplayed, and the non-display area NA of the folding area FA, the firstunfolding area UFA1 and the second unfolding area UFA2 may be an areawhere no screen is displayed.

In some exemplary embodiments, the folding area FA may be an area wherethe display device 1 is bent in the folding direction. In this case, thefolding area FA may be bent along the folding direction with referenceto a folding axis located between the folding lines FL1 and FL2.

As the folding area FA of the display device 1 is folded, the firstunfolding area UFA1 and the second unfolding area UFA2 may facedirections other than the front side. That is, when the display device 1is unfolded, the folding area FA, the first unfolding area UFA1 and thesecond unfolding area UFA2 may face the same direction, e.g., the frontside. When the display device 1 is folded by an out-folding force F_OUTof FIG. 4 , the first unfolding area UFA1 and the second unfolding areaUFA2 may face different directions from each other. That is, when thedisplay device 1 is folded, a screen may be displayed in a plurality ofdirections.

The display device 1 includes a display module 100, the first circuitboard 300 attached to the display module 100, and a second circuit board500 attached to the first circuit board 300. The display module 100 mayinclude a plurality of stacked panels and/or members as illustrated inFIG. 5 . The display module 100 may include a display panel 150, a lowercover panel 130 disposed under the display panel 150, an upper covermember 170 disposed on the display panel 150, and a window 190 disposedon the upper cover member 170.

A support plate 110 may be disposed on a bottom surface of the displaymodule 100.

The support plate 110 may prevent the display panel 150 from being bentby an external force or may reduce the degree to which the display panel150 is bent (e.g., a bending angle, a bending radius of curvature,etc.). That is, the support plate 110 may keep the display panel 150relatively flat against an external force.

The support plate 110 may include a rigid or semi-rigid material. In anexemplary embodiment, the support plate 110 may include a metal materialsuch as stainless steel (“SUS”) or aluminum or a polymer such aspolymethyl metacrylate (“PMMA”), polycarbonate (“PC”), polyvinylalcohol(“PVA”), acrylonitrile-butadiene-styrene (“ABS”) or polyethyleneterephthalate (“PET”).

Although not illustrated, the support plate 110 may be disposed in theunfolding areas UFA1 and UFA2 of the display device 1. In an exemplaryembodiment, the support plate 110 may include two sub-support plateswhich are not disposed in the folding area FA of the display device 1and are spaced apart from each other with the folding area FA interposedbetween them, for example.

Unless otherwise defined, the terms “above”, “top” and “upper surface”indicate a display surface side of the display panel 150, and the terms“below,” “bottom” and “lower surface” indicate an opposite side of thedisplay panel 150 from the display surface side.

The lower cover panel 130 may be disposed on the support plate 110. Thelower cover panel 130 may include at least one functional layer. Thefunctional layer may be a layer performing a buffering function, a heatdissipating function, an electromagnetic wave shielding function, agrounding function, a strength enhancing function, a support function, apressure sensing function a digitizing function, etc. The lower coverpanel 130 may be a single layer. However, the lower cover panel 130 isnot limited to a single layer and may also include a stack of differentfunctional layers. The lower cover panel 130 may include, for example, abuffer member. The buffer member may prevent the impact applied from theoutside (e.g., from under the lower cover panel 130) from beingtransmitted to the display panel 150. In an exemplary embodiment, thebuffer member may include a foam material such as polyurethane (“PU”),thermoplastic polyurethane (“TPU”), silicon (Si), orpolydimethylacrylamide (“PDMA”).

The lower cover panel 130 may have lower light transmittance than aplurality of members disposed on the display panel 150 to be describedlater. That is, layers disposed on the display panel 150 may haverelatively high light transmittance to transmit light emitted upwardfrom the display area DA of the display panel 150. The lower cover panel130 may have relatively low light transmittance to block light emitteddownward from the display area DA of the display panel 150.

The display panel 150 may be disposed on the lower cover panel 130.

The display panel 150 may display an image in response to an input datasignal. In exemplary embodiments, the display panel 150 may be anorganic light emitting display panel, a liquid crystal display panel, aplasma display panel, an electrophoretic display panel, anelectrowetting display panel, a quantum-dot light emitting displaypanel, a micro light emitting diode (“LED”) display panel, or the like.In the illustrated exemplary embodiment, an organic light emittingdisplay panel is applied as the display panel 150.

In an exemplary embodiment, the display panel 150 may include a flexiblesubstrate including a flexible polymer material such as polyimide(“PI”). Accordingly, the display panel 150 may be curved, bent, folded,or rolled. The display panel 150 may have substantially the same orsimilar shape as that of the planar shape of the display device 1.

A plurality of pixels PX may be disposed in the display area DA of thedisplay panel 150. The non-display area NA may include a panel pad areaP_PA where a plurality of wiring pads are disposed. The first circuitboard 300 to be described later may be attached to the panel pad areaP_PA and thus connected to the display panel 150 and may be foldedtoward a back surface of the display module 100. In addition, the secondcircuit board 500 to be described later may be folded toward the backsurface of the display module 100, like the first circuit board 300,while being attached to the first circuit board 300.

Each of the pixels PX may include a light emitting layer and a circuitlayer which controls the amount of light emitted from the light emittinglayer. The circuit layer may include a plurality of wirings, a pluralityof electrodes, and at least one transistor. The light emitting layer mayinclude an organic light emitting material. The light emitting layer maybe sealed by an encapsulation layer. The encapsulation layer may sealthe light emitting layer to prevent introduction of moisture from theoutside. The encapsulation layer may be composed of a single inorganiclayer or a plurality of inorganic layers or may be composed of aninorganic layer and an organic layer stacked alternately.

The upper cover member 170 may be disposed on the display panel 150.

The upper cover member 170 may overlap the display panel 150 to coverpart or all of the display area DA of the display panel 150. Inaddition, the upper cover member 170 may cover the non-display area NAof the display panel 150 or both the display area DA and the non-displayarea NA. The upper cover member 170 may include at least one of variousfunctional members. In an exemplary embodiment, the upper cover member170 may include a polarizing plate or member having a polarizingfunction, a touch panel or module having a touch sensing function, acolor filter, a color conversion film, an optical film, anantireflection member, and/or a biometric information recognition membersuch as a fingerprint recognition sensor, for example.

The window 190 may be disposed on the upper cover member 170.

The window 190 protects the members 110, 130, 150 and 170 disposed underthe window 190 by covering the members 110, 130, 150 and 170. In anexemplary embodiment, the window 190 may include glass, quartz,transparent plastic, etc.

The display module 100 may further include a plurality of bonding layersdisposed between the members 110, 130, 150, 170 and 190 to bond themembers 110, 130, 150, 170 and 190. A first bonding layer 210 may bedisposed between the support plate 110 and the lower cover panel 130 tobond them together. A second bonding layer 220 may be disposed betweenthe lower cover panel 130 and the display panel 150 to bond themtogether. A third bonding layer 230 may be disposed between the displaypanel 150 and the upper cover member 170 to bond them together. A fourthbonding layer 240 may be disposed between the upper cover member 170 andthe window 190 to bond them together.

In an exemplary embodiment, each of the bonding layers 210 through 240is a layer whose upper and lower surfaces have adhesive properties andmay be, for example, a pressure sensitive adhesive (“PSA”), an opticalclear adhesive (“OCA”), or an optical clear resin (“OCR”). Each of thebonding layers 210 through 240 may include acrylic resin or siliconeresin. In an exemplary embodiment, each of the bonding layers 210through 240 may have an elongation of about 100 percent (%) to about1,000%, for example.

The first circuit board 300 may be attached to the panel pad area P_PAof the display panel 150. Specifically, the first circuit board 300 maybe attached to the wiring pads of the display panel 150. The firstcircuit board 300 may include a printed base film 310, drivingintegrated circuits (“ICs”) 330 and 350 disposed on the printed basefilm 310, and a plurality of signal wirings SL3, SL4 and SL7 throughSL11 disposed on the printed base film 310. The first circuit board 300may be a flexible printed circuit board (“FPCB”) that may be foldedtoward the front surface and/or the back surface of the display module100.

As illustrated in FIGS. 1 and 2 , each of the driving ICs 330 and 350may be a driving chip. In an exemplary embodiment, the driving chip maybe, for example, a chip on film (“COF”).

The first circuit board 300 may include a plurality of circuit areas CA1through CA4. A first circuit area CA1 may be an area attached to thepanel pad area P_PA of the display panel 150, a second circuit area CA2may be an area in which a first driving IC 330 is disposed, a thirdcircuit area CA3 may be an area in which a second IC 350 is disposed,and a fourth circuit area CA4 may be an area to which the second circuitboard 500 is attached. The second circuit area CA2 may be disposedbetween the third circuit area CA3 and the first circuit area CA1, andthe third circuit area CA3 may be disposed between the second circuitarea CA2 and the fourth circuit area CA4.

The first circuit board 300 may be substantially rectangular in a planview. That is, the first circuit board 300 may include long edges LEG1and LEG2 and short edges SEG1 and SEG2. A first long edge LEG1 of thefirst circuit board 300 may be disposed on the first circuit area CA1and may be attached to the panel pad area P_PA of the display panel 150.A second long edge LEG2 of the first circuit board 300 may be disposedon the fourth circuit area CA4 and may be attached to the second circuitboard 500. A first short edge SEG1 of the first circuit board 300 may bedisposed on a left side in the plane of FIG. 1 , and the second shortedge SEG2 of the first circuit board 300 may be disposed on a right sidein the plane of FIG. 1 .

The printed base film 310 may include a flexible material. In anexemplary embodiment, the flexible material may be, for example,polyethersulphone (“PES”), polyacrylate (“PA”), polyarylate (“PAR”),polyetherimide (“PEI”), polyethylene naphthalate (“PEN”), polyethyleneterepthalate (“PET”), polyphenylene sulfide (“PPS”), polyallylate,polyimide (“PI”), polycarbonate (“PC”) cellulose triacetate (“CAT”),cellulose acetate propionate: (“CAP”), or a combination of the same.

The driving ICs 330 and 350 output signals and voltages for driving thedisplay panel 150. Each of the driving ICs 330 and 350 may include adata driver and a timing controller. The data driver of each of thedriving ICs 330 and 350 may output a data signal for driving each pixelPX of the display panel 150, and the timing controller of each of thedriving ICs 330 and 350 may control the timing of the data signalsoutput from the data driver.

In a state where the first circuit board 300 is folded toward the backsurface of the display module 100, the first driving IC 330 may bedisposed in the first unfolding area UFA1 of the display device 1, andthe second driving IC 350 may be disposed in the second unfolding areaUFA2 of the display device 1.

Each of the driving ICs 330 and 350 may be disposed on a surface of thebase film 310 which faces a direction the back surface of the displaydevice 1 faces during bending, as illustrated in FIGS. 1 and 4 .

As illustrated in FIGS. 1 and 4 , when the display device 1 is unfolded,the first driving IC 330 and the second driving IC 350 may not overlapeach other in a direction from the first unfolding area UFA1 toward thefolding area FA, for example, in the first direction DR1. Therefore,when the display device 1 is folded, the first driving IC 330 and thesecond driving IC 350 may be prevented from overlapping each other in athickness direction. In an exemplary embodiment, in a state where thefirst circuit board 300 is unfolded and a state where the first circuitboard 300 is folded toward the back surface of the display module 100,the first driving IC 330 may be disposed closer to the panel pad areaP_PA of the display panel 150 than the second driving IC 350, forexample. That is, the first driving IC 330 may be disposed closer to thefirst long edge LEG1 than the second driving IC 350. Therefore, when thedisplay device 1 is out-folded, a direct contact between the driving ICs330 and 350 may be prevented. This will be described later in detail.

Referring to FIG. 6 , when the display device 1 is unfolded, the firstdriving IC 330 and the second driving IC 350 may not overlap each otherin the direction from the first unfolding area UFA1 toward the foldingarea FA, for example, in the first direction DR1. Therefore, when thedisplay device 1 is folded, the first driving IC 330 and the seconddriving IC 350 may be prevented from overlapping each other in thethickness direction. In an exemplary embodiment, when the first circuitboard 300 is folded toward the back surface of the display module 100,the second driving IC 350 may be located closer to the second circuitboard 500 than the first driving IC 330, for example. In other words,the first driving IC 330 may be located further from the second circuitboard 500 than the second driving IC 350 is from the second circuitboard 500.

Although the first driving IC 330 is disposed in the first unfoldingarea UFA1 and the second driving IC 350 is disposed in the secondunfolding area UFA2 in FIGS. 1 and 2 , the invention is not limited tothis case, and the opposite case is also possible. In addition, althoughthe first driving IC 330 is closer to the panel pad area P_PA of thedisplay panel 150 than the second driving IC 350 is to the panel padarea P_PA, the invention is not limited to this case, and the oppositecase is also possible.

The signal wirings SL3, SL4 and SL7 through SL10 of the first circuitboard 300 may be disposed in the unfolding areas UFA1 and UFA2 in astate where the first circuit board 300 is folded toward the backsurface of the display module 100, but may not be disposed in thefolding area FA. An eleventh signal wiring SL11 may pass through thefolding area FA.

A third signal wiring SL3 may connect a first signal wiring SL1 of thesecond circuit board 500 to be described later to the display panel 150,and a fourth signal wiring SL4 may connect a second signal wiring SL2 ofthe second circuit board 500 to the display panel 150. As illustrated inFIG. 2 , the third signal wiring SL3 may be disposed adjacent to thefirst short edge SEG1, and the fourth signal wiring SL4 may be disposedadjacent to the second short edge SEG2.

A seventh signal wiring SL7 may connect a fifth signal wiring SL5 of thesecond circuit board 500 to be described later to the first driving IC330, an eighth signal wiring SL8 may connect a sixth signal wiring SL6of the second circuit board 500 to be described later to the seconddriving IC 350, a ninth signal wiring SL9 may connect the first drivingIC 330 to the display panel 150, a tenth signal wiring SL10 may connectthe second driving IC 350 to the display panel 150, and the eleventhsignal wiring SL11 may electrically connect the first driving IC 330 andthe second driving IC 350. The eleventh signal wiring SL11 may be atiming synchronization wiring which synchronizes each timing signal ofthe timing controller of each of the driving ICs 330 and 350.

In a state where the first circuit board 300 is folded toward the backsurface of the display module 100, the third signal wiring SL3, theseventh signal wiring SL7 and the ninth signal wiring SL9 may bedisposed in the first unfolding area UFA1, the fourth signal wiring SL4,the eighth signal wiring SL8 and the tenth signal wiring SL10 may bedisposed in the second unfolding area UFA2, and the eleventh signalwiring SL11 may be disposed over the first unfolding area UFA1, thefolding area FA and the second unfolding area UFA2.

Indented portions IDP1 and IDP2 may be defined in the long edges LEG1and LEG2 of the first circuit board 300, respectively. That is, a firstindented portion IDP1 recessed into the first circuit board 300 may bedefined in the first long edge LEG1 of the first circuit board 300 inthe folding area FA as compared with the first long edge LEG1 of thefirst circuit board 300 in the unfolding areas UFA1 and UFA2, and asecond indented portion IDP2 recessed into the first circuit board 300may be defined in the second long edge LEG2 of the first circuit board300 in the folding area FA as compared with the second long edge LEG2 ofthe first circuit board 300 in the unfolding areas UFA1 and UFA2. Thefirst indented portion IDP1 may be shaped like a trench recessed fromthe first long edge LEG1 of the first circuit board 300, and the secondindented portion IDP2 may be shaped like a trench recessed from thesecond long edge LEG2 of the first circuit board 300.

In FIGS. 1 and 2 , the first indented portion IDP1 is defined in thefirst circuit area CA1 of the first circuit board 300, and the secondindented portion IDP2 is disposed over the fourth circuit area CA4.However, the first indented portion IDP1 may also be defined in thesecond circuit area CA2 of the first circuit board 300, and the secondindented portion IDP2 may also be defined in the third circuit area CA3of the first circuit board 300.

Further, a plurality of folding holes PF may be defined in the firstcircuit board 300 between the first long edge LEG1 and the second longedge LEG2 in the folding area FA in a plan view. The folding holes PFmay be through holes passing through the first circuit board 300 in thethickness direction. Each of the folding holes PF may be disposed in thefirst circuit board 300 and may be surrounded by the constituentmaterial of the first circuit board 300 in a plan view. As illustratedin FIGS. 1 and 2 , the folding holes PF may be disposed over the secondcircuit area CA2 and the third circuit area CA3 of the first circuitboard 300.

Although the number of the folding holes PF is five in FIGS. 1 and 2 ,the number of the folding holes PF is not limited to five and may alsobe one, two to four, or six or more. In addition, although the foldingholes PF are circular in a plan view, the planar shape of each of thefolding holes PF is not limited to the circular shape and may also be atriangular shape, a quadrilateral shape, an elliptical shape, or othervarious shapes.

After the first circuit board 300 is folded toward the back surface ofthe display module 100, it may be folded together with the displaymodule 100 along the folding direction as will be described later. Theindented portions IDP1 and IDP2 and the folding holes PF of the firstcircuit board 300 described above may increase the flexibility of thefirst circuit board 300 during the folding of the first circuit board300.

The second circuit board 500 may include first and second basesubstrates 510 and 530, a third driving IC 570 disposed on the firstbase substrate 510, a flexible film 550 disposed on the base substrates510 and 530, and a plurality of signal wirings SL1, SL2, SL5 and SL6.

The first base substrate 510 and the second base substrate 530 may bespaced apart from each other. In a state where the second circuit board500 is folded toward the back surface of the display module 100, thefirst base substrate 510 may be disposed in the first unfolding areaUFA1 of the display device 1, and the second base substrate 530 may bedisposed in the second unfolding area UFA2 of the display device 1. Thatis, the first base substrate 510 and the second base substrate 530 maybe spaced apart from each other with the folding area FA interposedbetween them.

Each of the base substrates 510 and 530 may include a circuit pad areaC_PA attached to the first circuit board 300.

Since the second circuit board 500 includes the base substrates 510 and530 spaced apart from each other, the flexibility of the second circuitboard 500 may be secured in the folding area FA when the second circuitboard 500 is folded together with the display module 100.

The third driving IC 570 may include a source/drain IC and a voltagedriver. The source/drain IC may generate and transmit the data signal todata driving ICs of the first driving IC 330 and the second driving IC350, and the voltage driver may apply a high-potential voltage and/or alow-potential voltage to the display panel 150.

Although the third driving IC 570 is disposed on the first basesubstrate 510 in FIG. 1 , the invention is not limited to this case. Thethird driving IC 570 may also be disposed on the second base substrate530.

The first signal wiring SL1 may connect the third driving IC 570 and thefirst circuit board 300. Although one first signal wiring SL1 and onesecond signal wiring SL2 are illustrated in FIGS. 1 and 2 , each of thefirst signal wiring SL1 and the second signal wiring SL2 may also beprovided in plural numbers.

The first signal wiring SL1 may deliver a voltage generated by thevoltage driver of the third driving IC 570 to the third signal wiringSL3 of the first circuit board 300, although the invention is notlimited to this case. The third signal wiring SL3 may deliver thevoltage applied from the first signal wiring SL1 to a high-potentialvoltage wiring and/or a low-potential voltage wiring of the displaypanel 150.

The second signal wiring SL2 may deliver a voltage generated by thevoltage driver of the third driving IC 570 to the first circuit board300. That is, the second signal wiring SL2 may deliver the voltagegenerated by the voltage driver to the fourth signal wiring SL4 of thefirst circuit board 300. The fourth signal wiring SL4 may deliver thevoltage applied from the second signal wiring SL2 to a high-potentialvoltage wiring and/or a low-potential voltage wiring of the displaypanel 150.

The second signal wiring SL2 may extend from the third driving IC 570onto the second base substrate 530 via the flexible film 550 to bedescribed later. That is, the second signal wiring SL2 may be disposedover the base substrates 510 and 530 and the flexible film 550.

The fifth signal wiring SL5 may connect the third driving IC 570 and thefirst circuit board 300. In an exemplary embodiment, the fifth signalwiring SL5 may deliver the data signal generated by the source/drain ICof the third driving IC 570 to the first circuit board 300 through theseventh signal wiring SL7 of the first circuit board 300, for example.

The sixth signal wiring SL6, like the fifth signal wiring SL5, mayconnect the third driving IC 570 and the first circuit board 300. In anexemplary embodiment, the sixth signal wiring SL6 may deliver the datasignal generated by the source/drain IC of the third driving IC 570 tothe first circuit board 300 through the eighth signal wiring SL8 of thefirst circuit board 300, for example.

The sixth signal wiring SL6, like the second signal wiring SL2, mayextend from the third driving IC 570 onto the second base substrate 530via the flexible film 550 to be described later. That is, the sixthsignal wiring SL6 may be disposed over the base substrates 510 and 530and the flexible film 550.

The flexible films 550 may physically connect the first base substrate510 and the second base substrate 530. The flexible film 550 may bedisposed in the folding area FA of the display device 1.

Although the flexible film 550 is attached to each of the basesubstrates 510 and 530 while partially overlapping each of the basesubstrates 510 and 530, the invention is not limited to this case. Theflexible film 550 may also be connected to each of the base substrates510 and 530 by a connection portion.

The second signal wiring SL2 and the sixth signal wiring SL6 of thesecond circuit board 500 may be disposed on the flexible film 550 asdescribed above.

The flexible film 550 may include a more flexible material than that ofthe base substrates 510 and 530. In an exemplary embodiment, theflexible film 550 may include at least one of polyethersulphone (“PES”),polyacrylate (“PA”), polyarylate (“PAR”), polyetherimide (“PEI”),polyethylene naphthalate (“PEN”), polyethylene terepthalate (PET),polyphenylene sulfide (“PPS”), polyallylate, polyimide (“PI”),polycarbonate (“PC”), cellulose triacetate (“CAT”), cellulose acetatepropionate (“CAP”), and combinations of the same, for example.

Since the flexible film 550 includes the above flexible material, theflexibility of the second circuit board 500 may be secured in thefolding area FA when the second circuit board 500 is folded togetherwith the display module 100.

FIG. 7 is a perspective view illustrating a folded state of theexemplary embodiment of the display device 1.

Referring to FIG. 7 , when the out-folding force F_OUT acts on thedisplay device 1 in a direction toward the back surface of the displaydevice 1, the display module 100, the first circuit board 300, and thesecond circuit board 500 may be folded with reference to the foldingarea FA.

More specifically, the display module 100 may include a first surfacecorresponding to the front surface of the display device 1 and a secondsurface corresponding to the back surface of the display device 1. Whenthe out-folding force F_OUT acts on the display device 1, areas of thesecond surface of the display module 100 may face each other. That is,the first unfolding area UFA1 and the second unfolding area UFA2 of thesecond surface of the display module 100 may face each other.

When the display module 100 is folded, the first circuit board 300 andthe second circuit board 500 are also folded together with the displaymodule 100. Here, the first indented portion IDP1 and the secondindented portion IDP2 defined in the folding area FA of the firstcircuit board 300 as described above may ensure the flexibility of thefirst circuit board 300 during folding in an area where the firstcircuit board 300 is attached to each of the display panel 150 and thesecond circuit board 500.

Further, the folding holes PF defined in the folding area FA of thefirst circuit board 300 may ensure the flexibility of the first circuitboard 300 during folding, like the indented portions IDP1 and IDP2.

When the out-folding force F_OUT acts on the display device 1, areas ofthe surface of the first circuit board 300 on which the driving ICs 330and 350 are disposed may face each other. That is, the first unfoldingarea UFA1 and the second unfolding area UFA2 of the surface of the firstcircuit board 300 may face each other. In this case, the first drivingIC 330 disposed in the first unfolding area UFA1 and the second drivingIC 350 disposed in the second unfolding area UFA2 may physically contacteach other.

However, since the first driving IC 330 and the second driving IC 350 ofthe first circuit board 300 of the display device 1 in the exemplaryembodiment are disposed not to overlap each other in the direction fromthe first unfolding area UFA1 toward the folding area FA, for example,in the first direction DR1, when the display device 1 is out-folded, thefirst driving IC 330 and the second driving IC 350 may not overlap eachother in the thickness direction. This prevents a direct contact betweenthe driving ICs 330 and 350, thereby preventing the driving ICs 330 and350 from being physically damaged.

Hereinafter, other exemplary embodiments will be described. In thefollowing exemplary embodiments, the same elements s those of theabove-described embodiment will be indicated by the same referencenumerals, and a redundant description thereof will be omitted or givenbriefly.

FIG. 8 is a perspective view of an exemplary embodiment of a displaydevice 2. FIG. 9 is a perspective view illustrating a folded state ofthe exemplary embodiment of the display device 2.

Referring to FIGS. 8 and 9 , the display device 2 in the currentexemplary embodiment is different from the display device 1 in theexemplary embodiment of FIGS. 1 through 7 in that it is an “in”-foldabledisplay device. That is, an in-folding force F_IN may act on the displaydevice 2 in the current exemplary embodiment in a direction toward afront surface of the display device 2. Accordingly, a display module100, a first circuit board 300 a, and a second circuit board 500 may befolded with reference to a folding area FA.

More specifically, as described above in FIG. 4 , the display module 100may include a first surface corresponding to the front surface of thedisplay device 2 and a second surface corresponding to a back surface ofthe display device 2. When the in-folding force F_IN acts on the displaydevice 2, areas of the first surface of the display module 100 may faceeach other. That is, a first unfolding area UFA1 and a second unfoldingarea UFA2 of the first surface of the display module 100 may face eachother.

When the display module 100 is folded, the first circuit board 300 a andthe second circuit board 500 are also folded together with the displaymodule 100. Here, a first indented portion IDP1 and a second indentedportion IDP2 defined in the folding area FA of the first circuit board300 a as described above may ensure the flexibility of the first circuitboard 300 a during folding in an area where the first circuit board 300a is attached to each of a display panel 150 and the second circuitboard 500. Further, a plurality of folding holes PF defined in thefolding area FA of the first circuit board 300 a may ensure theflexibility of the first circuit board 300 a during folding, like theindented portions IDP1 and IDP2.

When the in-folding force F_IN acts on the display device 2 in thecurrent exemplary embodiment, areas of a surface of the first circuitboard 300 a on which driving ICs 330 a and 350 a are disposed may facedifferent directions, unlike the display device 1 in the exemplaryembodiment of FIGS. 1 through 7 . That is, the first unfolding area UFA1and the second unfolding area UFA2 of the surface of the first circuitboard 300 a may face different directions. In this case, a first drivingIC 330 a disposed in the first unfolding area UFA1 and a second drivingIC 350 a disposed in the second unfolding area UFA2 may face differentdirections.

As illustrated in FIGS. 8 and 9 , the first driving IC 330 a and thesecond driving IC 350 a may be aligned in a direction from the firstunfolding area UFA1 toward the folding area FA. That is, the firstdriving IC 330 a and the second driving IC 350 a may overlap each otherin the direction from the first unfolding area UFA1 toward the foldingarea FA.

In some exemplary embodiments, the first driving IC 330 a and the seconddriving IC 350 a of the first circuit board 300 a of the display device2 may not overlap each other in the direction from the first unfoldingarea UFA1 toward the folding area FA, for example, in the firstdirection DR1, as in the exemplary embodiment of FIGS. 1 through 7 .

FIG. 10 is a plan view of an exemplary embodiment of a display device 3.

Referring to FIG. 10 , the display device 3 in the current exemplaryembodiment is different from the display device 1 in the exemplaryembodiment of FIGS. 1 through 7 in that indented portions IDP1_1 andIDP2_1 of a first circuit board 300_1 have different widths.

More specifically, in the current exemplary embodiment of the displaydevice 3, the indented portions IDP1_1 and IDP2_1 of the first circuitboard 300_1 may have different widths in a direction from a firstunfolding area UFA1 toward a folding area FA, for example, in the firstdirection DR1.

That is, a first width W1 of a first indented portion IDP1_1 of thefirst circuit board 300_1 may be smaller than a second width W2 of asecond indented portion IDP2_1 of the first circuit board 300_1.

As described above in the exemplary embodiment of FIGS. 1 through 7 ,the first indented portion IDP1_1 may be defined in a first circuit areaCA1 of the first circuit board 300_1. When the first width W1 of thefirst indented portion IDP1_1 of the first circuit board 300_1 issmaller than the second width W2 of the second indented portion IDP2_1of the first circuit board 300_1 as in the current exemplary embodiment,the first circuit area CA1 of the first circuit board 300_1 may have agreater width in the first direction DR1. Therefore, more lead wiringsmay be placed in the first circuit area CA1 of the first circuit board300_1 to transmit signals to a plurality of wiring pads of a panel padarea P_PA of a display panel 150.

In this exemplary embodiment as well, when a display module 100 isfolded, the first circuit board 300_1 and a second circuit board 500 mayalso be folded together with the display module 100. Here, the firstindented portion IDP1_1 and the second indented portion IDP2_1 definedin the folding area FA of the first circuit board 300_1 as describedabove may ensure the flexibility of the first circuit board 300_1 duringfolding in an area where the first circuit board 300_1 is attached toeach of a display panel 150 and the second circuit board 500.

Further, a plurality of folding holes PF defined in the folding area FAof the first circuit board 300_1 may further ensure the flexibility ofthe first circuit board 300_1 during folding, like the indented portionsIDP1_1 and IDP2_1.

In addition, since a first driving IC 330 and a second driving IC 350 ofthe first circuit board 300_1 of the display device 3 in the currentexemplary embodiment are disposed not to overlap each other in thedirection from the first unfolding area UFA1 toward the folding area FA,for example, in the first direction DR1, when the display device 3 isout-folded, a direct contact between the driving ICs 330 and 350 isprevented, thereby preventing the driving ICs 330 and 350 from beingphysically damaged.

FIG. 11 is a plan view of an exemplary embodiment of a display device 4.

Referring to FIG. 11 , the display device 4 in the current exemplaryembodiment is different from the display device 1 in the exemplaryembodiment of FIGS. 1 through 7 in an area where a second signal wiringSL2_1 and a fourth signal wiring SL4_1 of a second circuit board 500_1are disposed.

More specifically, in the current exemplary embodiment of the secondcircuit board 500_1, the second signal wiring SL2_1 and the fourthsignal wiring SL4_1 extending from a third driving IC 570 disposed on afirst base substrate 510 may be connected to a second base substrate 530through a first circuit board 300 without being disposed on a flexiblefilm 550_1.

In an exemplary embodiment, the second signal wiring SL2_1 and thefourth signal wiring SL4_1 extending from the third driving IC 570 maybe connected to a first unfolding area UFA1 of the first circuit board300, for example. Although not illustrated, the first circuit board 300may further include a lead wiring connected to the second signal wiringSL2_1 and the fourth signal wiring SL4_1.

The lead wiring of the first circuit board 300 may extend to a secondunfolding area UFA2 of the first circuit board 300 along a secondindented portion IDP2 of the first circuit board 300 as illustrated inFIG. 11 .

The lead wiring of the first circuit board 300 which extends to thesecond unfolding area UFA2 of the first circuit board 300 may beconnected to the second base substrate 530.

In some exemplary embodiments, the arrangement of the second signalwiring SL2_1 and the fourth signal wiring SL4_1 in the current exemplaryembodiment and the arrangement of the second signal wiring SL2 and thefourth signal wiring SL4 in the exemplary embodiment of FIGS. 1 through7 may be combined.

In this exemplary embodiment as well, when a display module 100 isfolded, the first circuit board 300 and the second circuit board 500_1may also be folded together with the display module 100. Here, a firstindented portion IDP1 and the second indented portion IDP2 defined in afolding area FA of the first circuit board 300 as described above mayensure the flexibility of the first circuit board 300 during folding inan area where the first circuit board 300 is attached to each of adisplay panel 150 and the second circuit board 500_1.

Further, a plurality of folding holes PF defined in the folding area FAof the first circuit board 300 may further ensure the flexibility of thefirst circuit board 300 during folding, like the indented portions IDP1and IDP2.

In addition, since a first driving IC 330 and a second driving IC 350 ofthe first circuit board 300 of the display device 4 in the currentexemplary embodiment are disposed not to overlap each other in adirection from the first unfolding area UFA1 toward the folding area FA,for example, in the first direction DR1, when the display device 4 isout-folded, a direct contact between the driving ICs 330 and 350 isprevented, thereby preventing the driving ICs 330 and 350 from beingphysically damaged.

FIG. 12 is a plan view of an exemplary embodiment of a display device 5.

Referring to FIG. 12 , the display device 5 in the current exemplaryembodiment is different from the display device 1 in the exemplaryembodiment of FIGS. 1 through 7 in that a fourth driving IC 580 isfurther disposed on a second base substrate 530 of a second circuitboard 500_2.

More specifically, the second circuit board 500_2 may include first andsecond base substrates 510 and 530, a third driving IC 570 disposed onthe first base substrate 510, the fourth driving IC 580 disposed on thesecond base substrate 530, a flexible film 550 disposed on the basesubstrates 510 and 530, and a plurality of signal wirings SL1, SL2_2,SL5 and SL6_1.

The third driving IC 570 and the fourth driving IC 580 of the secondcircuit board 500_2 of the display device 5 may be disposed not tooverlap each other in a direction from a first unfolding area UFA1toward a folding area FA, for example, in the first direction DR1.Therefore, when the display device 5 is out-folded, a direct contactbetween the driving ICs 570 and 580 is prevented, thereby preventing thedriving ICs 570 and 580 from being physically damaged.

However, when the display device 5 is in-folded as in the exemplaryembodiment of FIGS. 8 and 9 , a surface of the second circuit board500_2 on which the driving ICs 570 and 580 are disposed may facedifferent directions. That is, the third driving IC 570 and the fourthdriving IC 580 may face different directions. In this case, the thirddriving IC 570 and the fourth driving IC 580 may be aligned in thedirection from the first unfolding area UFA1 toward the folding area FA.That is, the third driving IC 570 and the fourth driving IC 580 mayoverlap each other in the direction from the first unfolding area UFA1toward the folding area FA.

The fourth driving IC 580, like the third driving IC 570, may include asource/drain IC and a voltage driver.

A second signal wiring SL2_2 of the second circuit board 500_2 mayconnect the fourth driving IC 580 and a first circuit board 300. In anexemplary embodiment, the second signal wiring SL2_2 may deliver avoltage applied by the voltage driver of the fourth driving IC 580 to afourth signal wiring SL4 of the first circuit board 300, for example.

A sixth signal wiring SL6_1 of the second circuit board 500_2 mayconnect the fourth driving IC 580 and the first circuit board 300. In anexemplary embodiment, the sixth signal wiring SL6_1 may deliver a datasignal transmitted by the source/drain IC of the fourth driving IC 580to an eighth signal wiring SL8 of the first circuit board 300, forexample.

In some exemplary embodiments, each of the driving ICs 570 and 580 mayfurther include a timing controller, and a first driving IC 330 and asecond driving IC 350 may not include the timing controller. In thiscase, a timing synchronization wiring may be further provided on theflexible film 550 of the second circuit board 500_2 to connect the thirddriving IC 570 and the fourth driving IC 580.

In this exemplary embodiment as well, when a display module 100 isfolded, the first circuit board 300 and the second circuit board 500_2may also be folded together with the display module 100. Here, a firstindented portion IDP1 and a second indented portion IDP2 defined in thefolding area FA of the first circuit board 300 as described above mayensure the flexibility of the first circuit board 300 during folding inan area where the first circuit board 300 is attached to each of adisplay panel 150 and the second circuit board 500_2.

Further, a plurality of folding holes PF defined in the folding area FAof the first circuit board 300 may further ensure the flexibility of thefirst circuit board 300 during folding, like the indented portions IDP1and IDP2.

In addition, since the first driving IC 330 and the second driving IC350 of the first circuit board 300 of the display device 5 in thecurrent exemplary embodiment are disposed not to overlap each other inthe direction from the first unfolding area UFA1 toward the folding areaFA, for example, in the first direction DR1, when the display device 5is out-folded, a direct contact between the driving ICs 330 and 350 isprevented, thereby preventing the driving ICs 330 and 350 from beingphysically damaged.

FIG. 13 is a plan view of an exemplary embodiment of a display device 6.

Referring to FIG. 13 , the display device 6 in the current exemplaryembodiment is different from the display device 1 in the exemplaryembodiment of FIGS. 1 through 7 in that a third driving IC 570_1 of asecond circuit board 500_3 further includes a timing controller.

More specifically, the third driving IC 570_1 of the second circuitboard 500_3 may further include a timing controller. A timing signaloutput from the timing controller may be transmitted to driving ICs 330b and 350 b of a first circuit board 300 b.

Further, a first driving IC 330 b and a second driving IC 350 b may notinclude a timing controller, unlike the first driving IC 330 and thesecond driving IC 350 in the exemplary embodiment of FIGS. 1 through 7 .

The first circuit board 300 b of the display device 6 in the currentexemplary embodiment may not include an eleventh signal wiring SL11.

In this exemplary embodiment as well, when a display module 100 isfolded, the first circuit board 300 b and the second circuit board 500_3may also be folded together with the display module 100. Here, a firstindented portion IDP1 and a second indented portion IDP2 defined in afolding area FA of the first circuit board 300 b as described above mayensure the flexibility of the first circuit board 300 b during foldingin an area where the first circuit board 300 b is attached to each of adisplay panel 150 and the second circuit board 500_3.

Further, a plurality of folding holes PF defined in the folding area FAof the first circuit board 300 b may further ensure the flexibility ofthe first circuit board 300 b during folding, like the indented portionsIDP1 and IDP2.

In addition, since the first driving IC 330 b and the second driving IC350 b of the first circuit board 300 b of the display device 6 in thecurrent exemplary embodiment are disposed not to overlap each other in adirection from a first unfolding area UFA1 toward the folding area FA,for example, in the first direction DR1, when the display device 6 isout-folded, a direct contact between the driving ICs 330 b and 350 b isprevented, thereby preventing the driving ICs 330 b and 350 b from beingphysically damaged.

FIG. 14 is a plan view of an exemplary embodiment of a display device 7.

Referring to FIG. 14 , the display device 7 in the current exemplaryembodiment is different from the display device 1 in the exemplaryembodiment of FIGS. 1 through 7 in that a first circuit board 300_2 isseparated into two parts with a folding area FA interposed between them.

More specifically, the first circuit board 300_2 in the currentexemplary embodiment may include a first sub-circuit board 311 disposedin a first unfolding area UFA1 and a second sub-circuit board 312disposed in a second unfolding area UFA2. The first sub-circuit board311 and the second sub-circuit board 312 may be separated from eachother with the folding area FA interposed between them.

In the current exemplary embodiment of the display device 7, since thefirst circuit board 300_2 includes the two sub-circuit boards 311 and312 separated from each other with the folding area FA interposedbetween them, the flexibility of the first circuit board 300_2 may befurther ensured when the first circuit board 300_2 disposed on a backsurface of a display module 100 is folded together with the displaymodule 100.

In addition, since a first driving IC 330 and a second driving IC 350 ofthe first circuit board 300_2 of the display device 7 in the currentexemplary embodiment are disposed not to overlap each other in adirection from the first unfolding area UFA1 toward the folding area FA,for example, in the first direction DR1, when the display device 7 isout-folded, a direct contact between the driving ICs 330 and 350 isprevented, thereby preventing the driving ICs 330 and 350 from beingphysically damaged.

FIG. 15 is a plan view of an exemplary embodiment of a display device 8.

Referring to FIG. 15 , the display device 8 in the current exemplaryembodiment is different from the display device 5 in the exemplaryembodiment of FIG. 12 in that a second circuit board 500_4 does notinclude a flexible film 550.

More specifically, the second circuit board 500_4 in the currentexemplary embodiment may not include the flexible film 550 which isdisposed in a folding area FA and connects a first base substrate 510and a second base substrate 530. That is, the first base substrate 510and the second base substrate 530 may be physically separated from eachother.

Since the display device 8 in the current exemplary embodiment includesthe second circuit board 500_4 physically separated into two parts inthe folding area FA, the flexibility of the second circuit board 500_4may be further ensured in the folding area FA when the second circuitboard 500_4 disposed on a back surface of a display module 100 is foldedtogether with the display module 100.

A third driving IC 570 and a fourth driving IC 580 of the second circuitboard 500_4 of the display device 8 are disposed not to overlap eachother in a direction from a first unfolding area UFA1 toward the foldingarea FA, for example, in the first direction DR1 as illustrated in FIG.15 . Therefore, when the display device 8 is out-folded, a directcontact between the driving ICs 570 and 580 is prevented, therebypreventing the driving ICs 570 and 580 from being physically damaged.

However, when the display device 8 is in-folded as in the exemplaryembodiment of FIGS. 8 and 9 , the third driving IC 570 and the fourthdriving IC 580 may be aligned in the direction from the first unfoldingarea UFA1 toward the folding area FA.

In this exemplary embodiment as well, when the display module 100 isfolded, a first circuit board 300 and the second circuit board 500_4 mayalso be folded together with the display module 100. Here, a firstindented portion IDP1 and a second indented portion IDP2 defined in thefolding area FA of the first circuit board 300 as described above mayensure the flexibility of the first circuit board 300 during folding inan area where the first circuit board 300 is attached to each of adisplay panel 150 and the second circuit board 500_4.

Further, a plurality of folding holes PF defined in the folding area FAof the first circuit board 300 may further ensure the flexibility of thefirst circuit board 300 during folding, like the indented portions IDP1and IDP2.

In addition, since a first driving IC 330 and a second driving IC 350 ofthe first circuit board 300 of the display device 8 in the currentexemplary embodiment are disposed not to overlap each other in thedirection from the first unfolding area UFA1 toward the folding area FA,for example, in the first direction DR1, when the display device 8 isout-folded, a direct contact between the driving ICs 330 and 350 isprevented, thereby preventing the driving ICs 330 and 350 from beingphysically damaged.

FIG. 16 is a plan view of an exemplary embodiment of a display device 9.

Referring to FIG. 16 , the display device 9 in the current exemplaryembodiment is different from the display device 1 in the exemplaryembodiment of FIGS. 1 through 7 in that a first circuit board 300_3 doesnot include a first indented portion IDP1.

More specifically, a first long edge LEG1 of the first circuit board300_3 in the current exemplary embodiment may be substantially shapedlike a straight line along the first direction DR1. Therefore, a firstcircuit area CA1 of the first circuit board 300_3 may have a greaterwidth in the first direction DR1, and more lead wirings may be placed inthe first circuit area CA1 of the first circuit board 300_3 to deliversignals to a plurality of wiring pads of a panel pad area P_PA of adisplay panel 150. Accordingly, more signal channels may be securedbetween the first circuit board 300_3 and the display panel 150.

A plurality of folding holes PF of the first circuit board 300_3 may bedisposed between the first long edge LEG1 and a second indented portionIDP2 of the first circuit board 300_3.

In this exemplary embodiment as well, when a display module 100 isfolded, the first circuit board 300_3 and a second circuit board 500 mayalso be folded together with the display module 100. Here, the secondindented portion IDP2 defined in a folding area FA of the first circuitboard 300_3 as described above may ensure the flexibility of the firstcircuit board 300_3 during folding in an area where the first circuitboard 300_3 is attached to each of the display panel 150 and the secondcircuit board 500.

Further, the folding holes PF defined in the folding area FA of thefirst circuit board 300_3 may further ensure the flexibility of thefirst circuit board 300_3 during folding, like the indented portionIDP2.

In addition, since a first driving IC 330 and a second driving IC 350 ofthe first circuit board 300_3 of the display device 9 in the currentexemplary embodiment are disposed not to overlap each other in adirection from a first unfolding area UFA1 toward the folding area FA,for example, in the first direction DR1, when the display device 9 isout-folded, a direct contact between the driving ICs 330 and 350 isprevented, thereby preventing the driving ICs 330 and 350 from beingphysically damaged.

FIG. 17 is a plan view of an exemplary embodiment of a display device10.

Referring to FIG. 17 , the display device 10 in the current exemplaryembodiment is different from the display device 9 in the exemplaryembodiment of FIG. 16 in that a plurality of sub-folding holes PF_1 maybe further defined between a first long edge LEG1 of a first circuitboard 300_4 and an area in which a plurality of folding holes PF aredefined.

More specifically, in the first circuit board 300_4 in the currentexemplary embodiment, the sub-folding holes PF_1 may be further definedbetween the first long edge LEG1 and the area in which the folding holesPF are defined.

The sub-folding holes PF_1, like the folding holes PF, may be throughholes passing through a base film 310_4 of the first circuit board 300_4in the thickness direction.

The sub-folding holes PF_1 may have substantially the same or similarplanar shape as that of the folding holes PF, but may also have adifferent planar shape from that of the folding holes PF.

Although the number of the sub-folding holes PF_1 is two in FIG. 17 ,the number of the sub-folding holes PF_1 is not limited to two and mayalso be one, or three or more.

In the display device 10 in the current exemplary embodiment, since thesub-folding holes PF_1 are further disposed between the first long edgeLEG1 of the first circuit board 300_4 and the area in which the foldingholes PF are disposed, the flexibility of the first circuit board 300_4may be ensured during the folding of the first circuit board 300_4.

FIG. 18 is a perspective view of an exemplary embodiment of a displaydevice 11. FIG. 19 is a cross-sectional view taken along line XIX-XIX′of FIG. 18 .

Referring to FIGS. 18 and 19 , the display device 11 in the currentexemplary embodiment is different from the display device 1 in theexemplary embodiment of FIGS. 1 through 7 in that each of first andsecond driving ICs 330 and 350 is disposed inside a first circuit board300.

More specifically, the first driving IC 330 and the second driving IC350 may be aligned along the first direction DR1. The first driving IC330 and the second driving IC 350 may be disposed inside a base film 310of the first circuit board 300. Although surfaces of the first andsecond driving ICs 330 and 350 are aligned with a surface of the basefilm 310 in FIGS. 18 and 19 , the invention is not limited to this case,and the surfaces of the first and second driving ICs 330 and 350 mayalso be lower than an adjacent surface of the base film 310.

In the current exemplary embodiment of the display device 11, since thefirst and second driving ICs 330 and 350 are disposed inside the firstcircuit board 300 and their surfaces are located lower than the surfaceof the base film 310, the first and second driving ICs 330 and 350 maybe prevented from being physically damaged due to a physical contactwhen the display device 11 is folded.

FIG. 20 is a perspective view of an exemplary embodiment of a displaydevice 12.

Referring to FIG. 20 , the display device 12 in the current exemplaryembodiment is different from the display device 1 in the exemplaryembodiment of FIGS. 1 through 7 in that first and second driving ICs 330and 350 are spaced apart from a folding area FA by different distances.

More specifically, in the display device 12 in the current exemplaryembodiment, the first and second driving ICs 330 and 350 may be alignedalong the first direction DR1 from the folding area FA. In addition, thearea of a first circuit board 300 may be different on one side and theother side of the folding area FA in the first direction DR1. In anexemplary embodiment, as illustrated in FIG. 20 , the area of a side ofthe first circuit board 300 in the first direction DR1 on which thefirst driving IC 330 is disposed may be larger than the area of theother side in the first direction DR1 on which the second driving IC 350is disposed, for example. The distance from the folding area FA to thefirst driving IC 330 may be greater than the distance from the foldingarea FA to the second driving IC 350. In the current exemplaryembodiment, the distance from the folding area FA to the first drivingIC 330 may be greater than the sum of the distance between the seconddriving IC 350 and the folding area FA and a length of the seconddriving IC 350 in the first direction DR1.

Therefore, when the display device 12 is folded, the first driving IC330 and the second driving IC 350 may be prevented from overlapping eachother in the thickness direction, thereby preventing defects of thedisplay device 12.

In an exemplary embodiment of a display device, driving ICs disposed onan FPCB may be prevented from contacting each other during bending.

In addition, it is possible to provide a display device including anFPCB having flexibility in a folding area.

However, the effects of the exemplary embodiments are not restricted tothe one set forth herein. The above and other effects of the exemplaryembodiments will become more apparent to one of daily skill in the artto which the exemplary embodiments pertain by referencing the claims.

What is claimed is:
 1. An electronic device including a folding area, afirst area located on a side of the folding area, and a second arealocated on a second side of the folding area, the electronic devicecomprising: a display panel; and a first circuit board attached to thedisplay panel, the first circuit board comprising: a base film, a firstdriving integrated circuit disposed in the first area, and a seconddriving integrated circuit disposed in the second area, wherein thefirst driving integrated circuit and the second driving integratedcircuit do not overlap each other in a thickness direction of the basefilm during folding.
 2. The electronic device of claim 1, wherein afirst indented portion is recessed from a first edge of the firstcircuit board attached to the display panel in the folding area.
 3. Theelectronic device of claim 2, further comprising a second circuit boardwhich comprises a first base substrate attached to the first area of asecond edge facing the first edge of the first circuit board and asecond base substrate attached to the second area of the second edge,wherein a second indented portion of the first circuit board is recessedfrom the second edge in the folding area.
 4. The electronic device ofclaim 3, wherein a first width of the first indented portion in adirection from the first area toward the folding area is smaller than asecond width of the second indented portion in the direction from thefirst area toward the folding area.
 5. The electronic device of claim 3,wherein a plurality of folding holes is defined in the first circuitboard between the first indented portion and the second indented portionin the folding area, wherein the plurality of folding holes passesthrough the first circuit board in the thickness direction.
 6. Theelectronic device of claim 3, wherein the second circuit board furthercomprises a flexible film disposed in the folding area, wherein theflexible film connects the first base substrate and the second basesubstrate.
 7. The electronic device of claim 6, wherein the first basesubstrate comprises a third driving integrated circuit and a firstsignal wiring which connects the third driving integrated circuit andthe first circuit board, wherein the first signal wiring is disposedover the flexible film.
 8. The electronic device of claim 6, wherein thefirst base substrate comprises a third driving integrated circuit and afirst signal wiring which connects the third driving integrated circuitand the first circuit board, wherein the first signal wiring is disposedover the first circuit board along the second indented portion of thefirst circuit board.
 9. The electronic device of claim 1, furthercomprising a signal wiring which directly connects the first drivingintegrated circuit and the second driving integrated circuit, whereinthe signal wiring is a timing synchronization wiring.
 10. The electronicdevice of claim 1, wherein the first circuit board further comprises afirst sub-circuit board on which the first driving integrated circuit isdisposed and a second sub-circuit board on which the second drivingintegrated circuit is disposed, wherein the first sub-circuit board andthe second sub-circuit board are separated from each other with thefolding area interposed between the first sub-circuit board and thesecond sub-circuit board.
 11. The electronic device of claim 1, whereinthe first circuit board further comprises a first edge attached to thedisplay panel and a second edge facing the first edge, and an indentedportion is recessed from the second edge of the first circuit board. 12.The electronic device of claim 11, wherein a plurality of folding holesis defined in the first circuit board between the indented portion andthe first edge of the first circuit board in the folding area, whereinthe plurality of folding holes passes through the first circuit board inthe thickness direction.
 13. The electronic device of claim 1, whereinthe electronic device further comprises a display module including thedisplay panel, wherein the display module further comprises a firstsurface on which the first circuit board is disposed and a secondsurface which is located opposite the first surface, wherein the firstarea of the first surface of the display module and the second area ofthe first surface of the display module face each other with respect tothe folding area of the first surface.
 14. The electronic device ofclaim 1, wherein a first area of the first circuit board which overlapsthe first area has a greater width than a second area of the firstcircuit board which overlaps the second area, and a distance from thefolding area to the first driving integrated circuit is greater than adistance from the folding area to the second driving integrated circuit.15. An electronic device including a folding area, a first area locatedon a side of the folding area, and a second area located on a secondside of the folding area, the electronic device comprising: a displaypanel; and a first circuit board which comprises a first edge attachedto the display panel, wherein a first indented portion is recessed fromthe first edge of the first circuit board in the folding area, andwherein a plurality of folding holes is defined in the first circuitboard between the first indented portion and a second edge facing thefirst edge of the first circuit board in the folding area, wherein thefolding holes pass through the first circuit board in a thicknessdirection of the first circuit board.
 16. The electronic device of claim15, further comprising a second circuit board which comprises a firstbase substrate attached to the first area of the second edge facing thefirst edge of the first circuit board and a second base substrateattached to the second area of the second edge.
 17. The electronicdevice of claim 16, wherein a second indented portion is recessed fromthe second edge of the first circuit board in the folding area.
 18. Theelectronic device of claim 15, wherein the electronic device furthercomprises a display module including the display panel, wherein thedisplay module further comprises a first surface on which the firstcircuit board is disposed and a second surface which is located oppositethe first surface, wherein the first area of the first surface of thedisplay module and the second area of the second surface of the displaymodule face each other with respect to the folding area of the secondsurface.